MIOC-13-09-XX-N Multi-function Integrated Optic Chip for Gyroscope

Model: MIOC-13-09-XX-N
The main fiber optical gyroscope's components is a multifunctional integrated optical chip (MIOC). FOGPhotonics's MIOC is a solid state waveguide device on X-cut LiNbO3 substrate fabricated by high-temperature proton exchange method (HTPE). A very important advantage of proton exchange (PE) waveguides is the following. In such waveguides the extraordinary refraction index is increasing, while refraction index of ordinary ray is decreasing. As a result, proton exchanged waveguides support propagation only extraordinary polarization modes (TE in our case). Therefore, it is not necessary to use in the fiber optical gyroscope a polarizer, which brings additional loss.
To meet the requirements for defect-free edge polishing of high precision fiber optic gyroscope integrated optic modulator LiNbO3 chips, a new polishing process based on pad polishing was developed. According to the analysis on the causes for edge damage during the edge polishing, three solutions were presented:controlling the big particles in polishing material, choosing the low subface damage polishing and making the particles size close to or less than double of the critical cutting depth.  With the new process,the defect free edge polishing of LiNbO3 chips could be achieved and the results show that the edges under 1 500× microscope have no visible defect, the chip end face roughness Ra is less than 0.8 nm and the surface flatness reaches better than λ/2.Additional,this polishing process has great application value.

Product Features

    ● X-Cut, y-propagatingLiNbO3
    ● Very low insertionloss.
    ● APE process forwaveguide, works in single polarization
    ● High extinction ratio
    ● Fiber is slopingcoupled with waveguide, which deduce optical return far and away
    ● Push-pull electrodedesign may deduce half wave Voltage
    ● Small packaging andlightweight
    ● Excellent long-termstability

Technical Specification

Parameter

Unit

Values

Wavelength

nm

1310

Insertion

dB

≤4.0

Half wave Voltage

V

≤4.0

Splitting Beam Ratio

-

47/5353/47

Optical Return

dB

≥50

Polarization extinction ,chip

dB

≥55

Additional Intensity Modulating

-

≤0.2%

PM Pigtail Crosstalk

dB

≤-30

Electrode type

-

Push-pull modulating

Bandwidth

MHz

≥300

Pigtail type

-

PM

Work temperature

-40+70

Packaging dimensions

mm

30X8X5 or 35X10X5

 

Recommend Modulation Wave(Amplitude Value:≤3.5V)




 

Applications

● Fiber optic gyroscopes(FOG).
● Fiber optic currentsenser(FOCS)
● Hydrophone and other optic sensitive fields

● Itis for attitude control of movements such as aircrafts, ships, guided missiles,automobiles etc in the fiber gyroscope system, Hydrophone and other opticsensitive fields. Faraday Effect was used to measure current through fibercircuit in the current sensing system.


Chip Structure


   


Different packages


New package of Naked ceramic package

   


Package Common Size


Outline Dimensions:

Items

Description

1

Ground(GND)

2

Signal

3

Signal


Package Mini Size




Ordering Information

Type

Description

MIOC-13-09-09-N

1310nm integrated optical chips ( Y waveguide) input/output: 125/250um PM fiber, 1m fiber length, without connector

MIOC-13-09-80-N

1310nm integrated optical chips ( Y waveguide)  input: 125/250um PM fiber, output with 80/165um PM fiber, 1m fiber length, without connector

Aerospce grade’s MIOC with full temperature testing and all conditions’s testing.
We can provide different pigtail and package by customer requirement.
For more information on this or other products and their availability, please contact us:info@idealphotonics.com

Operation Instructions
a). If the devices work under the single state of polarization, the polarization state of input light must conform to devices.
b).Avoid the Electrical damage of the devices; the electrode voltage of modulators should be lower 30V.
c) .Applying too much force to fiber may cause it broking easily. Avoid drawing、twisting.Bending radius must not be less than 30nm.
d) Avoid too much force between metal tube and fibers. Put up the tube and the fibers together when using it. Avoid bending at the joint of the tube and the fibers.
e) Storage environment humidity must be less than 50%, and not contain the materials which damages devices.
f) Avoid the devices suffering from intense thermal shock and inhomogeneous by heated
g) Avoid stressing to the joint of the fiber connection circuits.


Product Testing Report   



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